The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2025

Filed:

Dec. 18, 2023
Applicant:

Lifelens Technologies, Inc., Ivyland, PA (US);

Inventors:

Landy Toth, Doylestown, PA (US);

Robert S. Schwartz, Inver Grove Heights, MN (US);

Assignee:

LifeLens Technologies, Inc., Ivyland, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); A61B 5/05 (2021.01); A61B 5/145 (2006.01); A61B 5/15 (2006.01); A61B 5/25 (2021.01); A61B 5/259 (2021.01); B32B 3/06 (2006.01); B32B 3/08 (2006.01); B32B 3/10 (2006.01); B32B 3/26 (2006.01); B32B 5/18 (2006.01); B32B 7/02 (2019.01); B32B 7/06 (2019.01); B32B 7/10 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 9/06 (2006.01); B32B 25/06 (2006.01); B32B 25/08 (2006.01); B32B 25/10 (2006.01); B32B 25/12 (2006.01); B32B 25/14 (2006.01); B32B 25/16 (2006.01); B32B 25/20 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/12 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); B32B 29/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/259 (2021.01); A61B 5/145 (2013.01); A61B 5/150022 (2013.01); A61B 5/150343 (2013.01); A61B 5/150969 (2013.01); A61B 5/25 (2021.01); B32B 3/06 (2013.01); B32B 3/08 (2013.01); B32B 3/10 (2013.01); B32B 3/26 (2013.01); B32B 3/266 (2013.01); B32B 5/18 (2013.01); B32B 7/02 (2013.01); B32B 7/06 (2013.01); B32B 7/10 (2013.01); B32B 7/12 (2013.01); B32B 9/045 (2013.01); B32B 9/047 (2013.01); B32B 9/06 (2013.01); B32B 25/06 (2013.01); B32B 25/08 (2013.01); B32B 25/10 (2013.01); B32B 25/12 (2013.01); B32B 25/14 (2013.01); B32B 25/16 (2013.01); B32B 25/20 (2013.01); B32B 27/065 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/40 (2013.01); B32B 29/007 (2013.01); A61B 2562/028 (2013.01); A61B 2562/12 (2013.01); A61B 2562/125 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/44 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2266/12 (2016.11); B32B 2270/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/308 (2013.01); B32B 2307/51 (2013.01); B32B 2307/546 (2013.01); B32B 2307/706 (2013.01); B32B 2307/732 (2013.01); B32B 2437/00 (2013.01); B32B 2437/02 (2013.01); B32B 2439/46 (2013.01); B32B 2457/00 (2013.01); B32B 2535/00 (2013.01);
Abstract

A method includes forming a film, forming a first pattern of two or more vias at least partially through the film, attaching the film to a first support structure, the first support structure comprising an adhesive layer formed over a first carrier, wherein attaching the film to the first support structure comprises bonding a first surface of the film to the adhesive layer of the first support structure, wherein the film is stretchable in at least a first direction along the first surface, and wherein the first carrier maintains the first pattern of vias within a given threshold distortion following a given process conducted after attaching the film to the first support structure.


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