The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Oct. 20, 2022
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Nak Cho Choi, Yongin-si, KR;

Sang Woo An, Asan-si, KR;

Yong Duck Son, Seongnam-si, KR;

Won Ho Jang, Hwaseong-si, KR;

Myung Koo Hur, Asan-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); G09F 9/302 (2006.01); G09F 9/33 (2006.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); G09F 9/3026 (2013.01); G09F 9/33 (2013.01); H01L 25/0753 (2013.01); H10H 20/0364 (2025.01);
Abstract

A display device includes a substrate including a first surface, a second surface opposite the first surface, a first chamfered surface extending from a side of the first surface, a second chamfered surface extending from a side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface, a plurality of subpixels on the first surface, a side wiring on the first surface, the first chamfered surface, the first side surface, the second chamfered surface, and the second surface of the substrate, and a circuit board on the second surface. The side wiring comprises a first portion on the first surface and a second portion on the first side surface, and includes metal particles where a packing density of the metal particles in the first portion is higher than a packing density of the metal particles in the second portion.


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