The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Nov. 09, 2022
Applicant:

Vuereal Inc., Waterloo, CA;

Inventors:

Gholamreza Chaji, Waterloo, CA;

Ehsanollah Fathi, Waterloo, CA;

Assignee:

VueReal Inc., Waterloo, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/01 (2025.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/01 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10D 86/0214 (2025.01); H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/857 (2025.01); H01L 2221/68322 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H10H 20/0364 (2025.01);
Abstract

In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.


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