The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Nov. 09, 2022
Applicant:

Hoffman Enclosures Inc., Anoka, MN (US);

Inventors:

Matthew R. Archibald, Derry, NH (US);

Abhishek Gupta, Maple Grove, MN (US);

William Martin, Brooklyn Center, MN (US);

Stefan Djuranec, Hofen, DE;

Michael J. Koehler;

Marc Caiola, Anoka, MN (US);

Assignee:

Hoffman Enclosures Inc., Anoka, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G05D 23/19 (2006.01); H05K 7/14 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); G05D 23/1917 (2013.01); G05D 23/1931 (2013.01); H05K 7/1488 (2013.01); H05K 7/20263 (2013.01); H05K 7/20281 (2013.01); H05K 7/20645 (2013.01); H05K 7/20781 (2013.01); H05K 7/2079 (2013.01); G06F 1/206 (2013.01); Y02D 10/00 (2018.01);
Abstract

Embodiments of the invention provide a high density liquid cooling system and various monitoring and control methods. Some methods include calculating a heat transfer efficiency of a heat exchanger based on a temperature difference and calculating a total heat rejection value based on the heat transfer efficiency. Some methods include increasing a secondary flow rate in a secondary coolant loop as a maximum allowable pressure is approached to extend an operating time period and avoid thermal shut down of the high density liquid cooling system.


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