The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Aug. 03, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Kenji Matsuda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H05K 1/0242 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2201/09336 (2013.01); H05K 2201/09354 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/1572 (2013.01);
Abstract

A multilayer body includes insulator layers including a first insulator layer laminated in a vertical direction. Electrodes include a signal electrode and are provided at an upper main surface of the first insulator layer and arranged in a transverse direction. At least a portion of each of the electrodes is exposed to outside from a circuit board. First and second interlayer connection conductors extend through the first insulator layer in the vertical direction and electrically connect the signal electrode and a signal conductor layer. Mounting portions are located at the portions of the electrodes that are exposed to the outside from the circuit board. The first and second interlayer connection conductors are electrically connected to the signal electrode so as not to overlap the mounting portion that is provided at the signal electrode.


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