The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Apr. 24, 2022
Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., Beijing, CN;
Abstract
A flexible printed circuit board includes a substrate, a first conductive layer, a first protective layer and a support body. The substrate has a device region and a non-device region, and the device region is configured to be coupled to a chip. The first conductive layer is located on a side of the substrate. The first protective layer is located on a side of the first conductive layer away from the substrate. The first protective layer is provided therein with an accommodation space. The support body is located at least in the accommodation space. An orthographic projection of the support body on the substrate at least overlaps with at least one of the device region and the non-device region of the substrate.