The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Oct. 07, 2022
Murata Manufacturing Co., Ltd., Kyoto, JP;
Teruaki Oshita, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
To achieve miniaturization. A matching circuit is connected to a connection terminal that is one of an input terminal and an output terminal of an amplifier. A mounting substrate has a ground layer. The matching circuit includes a main line, a sub-line, and an IC chip. The main line is formed of a first conductor pattern intersecting a thickness direction of the mounting substrate, and is connected to a connection terminal of the amplifier. The sub-line is formed of a second conductor pattern intersecting the thickness direction of the mounting substrate, and is connected between the main line and the ground layer. The sub-line is opposed to the main line in the thickness direction of the mounting substrate. The IC chip is disposed on the mounting substrate, and includes an adjustment unit that adjusts impedance conversion characteristics of the matching circuit.