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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12463190 B1

PDFFull Text
Date of Patent:
Nov. 04, 2025

Filed:

Apr. 24, 2020

Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method therefor

Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Tatsuya Yahata, Tokyo, JP;

Kohei Taniguchi, Tokyo, JP;

Shintaro Hashimoto, Tokyo, JP;

Yoshinobu Ozaki, Tokyo, JP;

Assignee:

RESONAC CORPORATION, TOKYO, JP;

Attorney:

SOEI PATENT & LAW FIRM

Primary Examiner:

Eugene Lee

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 24/48 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/83874 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01);
Abstract

A semiconductor device according to the present disclosure has a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, in which the support piece contains a cured product of a thermosetting resin composition, or includes a layer containing a cured product of a thermosetting resin composition, and a resin layer or a metal layer.

Find Patent Forward Citations

Yahata, Tatsuya. (2025). Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method therefor (U.S. Patent No. 12463190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12463190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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