The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Dec. 23, 2022
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Peter D. Brewer, Westlake Village, CA (US);

Yan Tang, Oak Park, CA (US);

Chia-Ming Chang, Agoura Hills, CA (US);

Sevag Terterian, Lake Balboa, CA (US);

Charbel Abijaoude, Newbury Park, CA (US);

John J. Vajo, West Hills, CA (US);

Assignee:

THE BOEING COMPANY, Arlington, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13123 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/1317 (2013.01); H01L 2224/13171 (2013.01); H01L 2224/13172 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/13181 (2013.01); H01L 2224/81052 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/01003 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01);
Abstract

A reversable attachment system includes an adhesion layer, an inter-substrate bond structure, a mating layer and an extension actuator. The adhesion layer is configured to attach to a first substrate. The inter-substrate bond structure is coupled to the adhesion layer. The mating layer is configured to attach to a second substrate. The extension actuator is configured to attach to the second substrate and expand in response to an absorption of a gas. The inter-substrate bond structure is configured to form an initial thermocompression bond with the mating layer in response to an applied pressure and an applied heat. The expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer.


Find Patent Forward Citations

Loading…