The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Dec. 10, 2019
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Hideo Komo, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 23/3107 (2013.01);
Abstract
A heat spreader () is provided on an upper surface of a cooling plate () with an insulating layer () interposed therebetween. A semiconductor chip () is provided on the heat spreader (). Mold resin () seals the upper surface of the cooling plate (), the heat spreader (), and the semiconductor chip (). The insulating layer () does not protrude from the heat spreader () to a side of the heat spreader (). A groove () is provided on the upper surface of the cooling plate () below a peripheral portion of the heat spreader (). The insulating layer () is provided to overhang the groove ().