The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Mar. 03, 2021
3m Innovative Properties Company, St. Paul, MN (US);
Jiwoong Kong, Hwaseong-si, KR;
Jung Ju Suh, Seocho-gu, KR;
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
According to an embodiment of the present invention, an electronic assembly comprises: a circuit board including a plurality of connection parts having electrical conductivity; a plurality of spaced apart semiconductor integrated circuits mounted on the circuit board and electrically connected to the plurality of connection parts; a protective layer disposed on the plurality of semiconductor integrated circuits, substantially surrounding the semiconductor integrated circuits, and having a flat upper surface; and a heat spreading copper layer disposed on the protective layer, having an average thickness greater than or equal to about 3 microns, and an average grain size greater than about 0.15 micron, wherein the heat spreading copper layer may occupy substantially the same space in a length and a width as the circuit board (coextensive), and the average thickness of the protective layer may be equal to or greater than the height of the plurality of spaced apart semiconductor integrated circuits.