The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Apr. 27, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jun Woo Myung, Suwon-si, KR;
Gun Lee, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package including a first redistribution structure including a first redistribution layer disposed therein, a first semiconductor chip disposed on the first redistribution structure, an insulating layer surrounding a sidewall of the first semiconductor chip, the insulating layer spaced apart from the first semiconductor chip in a horizontal direction, a first connection structure extending through the insulating layer in a vertical direction, connected to the first redistribution structure, and includes a first via disposed inside the insulating layer. A second connection structure disposed between the first semiconductor chip and the first connection structure, extends through the insulating layer in the vertical direction, connected to the first redistribution structure, and includes a second via disposed inside the insulating layer. A molding layer covering the first semiconductor chip, a sidewall and an upper surface of the insulating layer. At least a portion of the molding layer disposed between the first and second vias.