The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
May. 27, 2022
Applicant:
Mitsui Chemicals Ict Materia, Inc., Tokyo, JP;
Inventors:
Assignee:
MITSUI CHEMICALS ICT MATERIA, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 7/22 (2018.01); C09J 133/10 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/22 (2018.01); C09J 133/10 (2013.01); C09J 2203/326 (2013.01); C09J 2301/122 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2301/416 (2020.08); C09J 2301/50 (2020.08); H01L 21/304 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68386 (2013.01);
Abstract
A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at −15° C. is defined as E' (−15° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.) in a case where a viscoelastic characteristic is measured, E′ (100° C.) is 1.0×10to 3.5×10Pa, and E′ (100° C.)/E′ (−15° C.) is 2.0×10to 1.5×10.