The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Aug. 11, 2020
Applicant:

Xiamen University, Fujian, CN;

Inventor:

Honggang Liao, Fujian, CN;

Assignee:

XIAMEN UNIVERSITY, Fujian, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/26 (2006.01); G01N 23/04 (2018.01); H01J 37/20 (2006.01); H01L 23/38 (2006.01); H10N 10/82 (2023.01); H10N 10/851 (2023.01); H10N 10/852 (2023.01);
U.S. Cl.
CPC ...
H01J 37/26 (2013.01); G01N 23/04 (2013.01); H01J 37/20 (2013.01); H01L 23/38 (2013.01); H10N 10/82 (2023.02); H10N 10/852 (2023.02); H10N 10/8556 (2023.02);
Abstract

A transmission electron microscope high-resolution in situ fluid freezing chip includes a lower chip and an upper chip. The lower chip is provided with a support layer, a freezing layer, an insulating layer, an opening, and a center window. The freezing layer is provided with contact electrodes, semiconductor films, and a conductive metal film. The center window is surrounded by the conductive metal film; the contact electrodes are disposed at an edge of the chip. One ends of the semiconductor films are lapped on the conductive metal film, and the other ends are lapped on the electrodes. In the outer edge of the conductive metal film, silicon is etched to form the opening. The support layer covers the opening. The conductive metal film is disposed on the support layer. A plurality of holes are provided in the center window.


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