The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Apr. 14, 2023
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Dinesh D. Gaitonde, Fremont, CA (US);

Aashish Tripathi, Hyderabad, IN;

Ashit Debnath, Hyderabad, IN;

Davis Boyd Moore, Longmont, CO (US);

Maithilee Rajendra Kulkarni, Santa Clara, CA (US);

Abhishek Kumar Jain, Ghaziabad, IN;

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4059 (2013.01); G06F 13/4068 (2013.01);
Abstract

A 3D device includes a first semiconductor chip and a second semiconductor chip stacked vertically. The first semiconductor chip includes a first plurality of tiles. The second semiconductor chip includes a second plurality of tiles. A bus electrically couples each of the first plurality of tiles to a corresponding one of the second plurality of tiles based on assignments of the first plurality of tiles and the second plurality of tiles to tile-to-tile pairs that define a minimized sum of bus delays among each possible tile-to-tile pairs. In each tile-to-tile pair, a net electrically couples each of a first plurality of pins to a corresponding one of a second plurality of pins based on assignments of the first plurality of pins to the second plurality of pins that define a minimized sum of net delays among each possible pin-to-pin pairs.


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