The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Aug. 10, 2023
Applicant:

Sandisk Technologies, Inc., Milpitas, CA (US);

Inventor:

Matthew Harris Klapman, San Jose, CA (US);

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 13/38 (2006.01);
U.S. Cl.
CPC ...
G06F 13/382 (2013.01); G06F 2213/0042 (2013.01);
Abstract

This disclosure a smart card device that provides a bus interface, such as a USB-C bus interface, printed on a portion of a PCB that forms a base layer of the smart card device. The smart card device can provide the bus interface without having to mount a traditional socket. By leveraging the portion of the PCB to provide a printed bus interface and excluding the traditional socket, the bus interface can be easily manufactured using well-known PCB manufacturing techniques while significantly reducing manufacturing costs. Furthermore, the smart card device can have a thickness that conforms to known card form factor standards, enabling the smart device to fit within a standard wallet. To enhance durability of the portion of the PCB from wear-and-tear, a metal core can be added to the PCB as an additional layer. The portion may also be reinforced with edge plating.


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