The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Mar. 04, 2024
Qualcomm Incorporated, San Diego, CA (US);
Prakhar Srivastava, Lucknow, IN;
Santhosh Reddy Akavaram, Hyderabad, IN;
Chintalapati Bharath Sai Varma, Hyderabad, IN;
Ravi Kumar Sepuri, Hyderabad, IN;
Khushboo Kumari, Noida, IN;
Qualcomm Incorporated, San Diego, CA (US);
Abstract
An integrated circuit (IC) device, implemented using chiplets mounted on a substrate, may include a controller and a first plurality of link modules. The first plurality of link modules may be configured to provide data lanes in a multimodule data communication link. The controller may be configured to retrain a failed link module in the first plurality of link modules while one or more other link modules in the first plurality of link modules are active and available for transmitting or receiving data, reconfigure the multimodule data communication link to use a second plurality of link modules that excludes the failed link module and includes fewer link modules than the first plurality of link modules, and reconfigure the multimodule data communication link to use the first plurality of link modules for transmitting or receiving the data after the failed link module has been successfully retrained.