The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Feb. 07, 2023
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Aparna R. Prasad, San Jose, CA (US);

Norbert Schlepple, Macungie, PA (US);

Vipulkumar K. Patel, Breinigsville, PA (US);

Arturo Pachon Munoz, San Jose, CA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/13 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); G02B 6/13 (2013.01); G02B 2006/12061 (2013.01);
Abstract

An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.


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