The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Jan. 26, 2022
Applicant:

Unm Rainforest Innovations, Albuquerque, NM (US);

Inventors:

Steven R. J. Brueck, Albuquerque, NM (US);

Alexander Neumann, Albuquerque, NM (US);

Payman Zarkesh-Ha, Albuquerque, NM (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 1/06 (2006.01); G01J 1/44 (2006.01); G01J 3/02 (2006.01); G01J 3/18 (2006.01); G01J 3/28 (2006.01); G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/124 (2006.01); H10F 30/221 (2025.01); H10F 39/10 (2025.01); H10F 77/00 (2025.01); H10F 77/30 (2025.01); H10F 77/40 (2025.01);
U.S. Cl.
CPC ...
G01J 1/06 (2013.01); G01J 1/44 (2013.01); G01J 3/0218 (2013.01); G01J 3/0259 (2013.01); G01J 3/18 (2013.01); G01J 3/1895 (2013.01); G01J 3/2803 (2013.01); G02B 6/122 (2013.01); G02B 6/124 (2013.01); H10F 30/221 (2025.01); H10F 39/107 (2025.01); H10F 77/334 (2025.01); H10F 77/413 (2025.01); H10F 77/953 (2025.01); G01J 2001/448 (2013.01); G02B 6/12004 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12107 (2013.01); G02B 2006/12138 (2013.01);
Abstract

An occupancy sensor covering a wide field in an integrated chip is disclosed. The occupancy sensor includes an array of grating coupled waveguide sensors wherein continuous wave (cw) signals monitor an ambient light field for dynamic changes on times scales of seconds, and high frequency signals map in three-dimensions of the space using time-of-flight (TOF) measurements, pixel level electronics that perform signal processing; array level electronics that perform additional signal processing; and communications and site level electronics that interface with actuators to respond to occupancy sensing.


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