The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Sep. 14, 2022
Applicant:

Parker-hannifin Corporation, Cleveland, OH (US);

Inventors:

Eric R. Coyle, Chesterfield, MO (US);

Dylan T. Yegge, Washington, MO (US);

Assignee:

Parker-Hannifin Corporation, Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 41/335 (2021.01);
U.S. Cl.
CPC ...
F25B 41/335 (2021.01);
Abstract

A thermal sensor assembly for a thermostatic expansion valve includes an enclosure that forms an enclosed interior space containing a thermal sensing fluid, and an opening in the enclosure for charging the thermal sensing fluid. A ball is arranged in the opening and forms a fluid seal between a sealing surface and a sealing interface of the assembly. The sealing surface may be made with a material that is softer than a material of the sealing interface, such that the sealing surface conforms to the sealing interface and fluidly seals the thermal sensing fluid in the enclosed interior space of the enclosure. The opening may include a tapered lead-in hole that tapers radially inwardly as the lead-in hole extends toward the interior space to thereby form the seal. A cover may be attached to an exterior surface of the enclosure to hold the ball in the opening to form the seal.


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