The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Apr. 18, 2024
Applicant:

Federal-mogul Powertrain Llc, Northville, MI (US);

Inventors:

Thomas Sueur, Crepy-en-Valois, FR;

Damien D'Almeida, Crepy-en-Valois, FR;

Sophie Pinceloup, Chelles, FR;

Julien Deltor, Margny-les-Compiegne, FR;

Assignee:

Systems Protection Group US LLC, Northville, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
D03D 15/533 (2021.01); B32B 1/08 (2006.01); B32B 5/02 (2006.01); B32B 5/08 (2006.01); B32B 15/14 (2006.01); D03D 1/00 (2006.01); D03D 11/02 (2006.01); D03D 15/25 (2021.01); D03D 15/283 (2021.01); D03D 15/67 (2021.01);
U.S. Cl.
CPC ...
D03D 1/0043 (2021.05); B32B 1/08 (2013.01); B32B 5/024 (2013.01); B32B 5/08 (2013.01); B32B 15/14 (2013.01); D03D 1/0058 (2013.01); D03D 11/02 (2013.01); D03D 15/25 (2021.01); D03D 15/283 (2021.01); D03D 15/533 (2021.01); D03D 15/67 (2021.01); B32B 2262/128 (2021.05); B32B 2262/148 (2021.05); B32B 2307/202 (2013.01); B32B 2597/00 (2013.01); D10B 2101/20 (2013.01); D10B 2401/16 (2013.01);
Abstract

A woven EMI sleeve has a wall with opposite edges extending lengthwise between opposite ends. The wall is wrapped about a central longitudinal axis into a tubular configuration bounding an enclosed cavity sized for receipt of an elongate member therein. The wall is woven with warp filaments extending generally parallel to the central longitudinal axis and weft filaments extending generally transversely to the warp filaments. The warp filaments include conductive filaments provided as wire filaments and separate non-conductive warp filaments. The weft filaments include heat-set filaments that are heat-formed to bias the wall into the tubular configuration and to bias opposite edges into overlapping relation with one another. The weft filaments also include conductive filaments.


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