The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Nov. 10, 2020
Applicant:

Dyson Technology Limited, Wiltshire, GB;

Inventors:

Michael Edward Rendall, Newbury, GB;

Robert Ian Joseph Gruar, Swindon, GB;

Assignee:

Dyson Technology Limited, Wiltshire, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/56 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 14/56 (2013.01); C23C 16/45536 (2013.01); H01J 37/3277 (2013.01);
Abstract

Apparatus for sputter deposition of target material to a substrate is disclosed. In one form, the apparatus includes a substrate guide arranged to guide a substrate along a curved path and a target portion spaced from the substrate guide and arranged to support target material. The target portion and the substrate guide define between them a deposition zone. The apparatus includes a confining arrangement including one or more magnetic elements arranged to provide a confining magnetic field to confine plasma in the deposition zone thereby to provide for sputter deposition of target material to the web of substrate in use. The confining magnetic field includes magnetic field lines arranged to, at least in the deposition zone, substantially follow a curve of the curved path so as to confine said plasma around said curve of the curved path.


Find Patent Forward Citations

Quick Actions:

Rendall, Michael. (2025). Method and apparatus for sputter deposition of target material to a substrate (U.S. Patent No. 12460300). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12460300

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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