The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Jan. 08, 2021
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Shreenath Anandakrishnan, Bangalore, IN;
Kuan-Ting Wu, Taipei, TW;
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 5/00 (2006.01); C09D 7/48 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 175/04 (2006.01);
U.S. Cl.
CPC ...
C09D 5/00 (2013.01); C09D 7/48 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 175/04 (2013.01);
Abstract
Herein is described a substrate coated with a thermal management material for an electronic device, wherein the thermal management material comprises: a thermal conductive coat deposited on the substrate; and a heat insulation coat deposited on the thermal conductive coat, wherein the heat insulation coat comprises a plant root powder and a resin. A process for coating the substrate with a thermal management material, and an electronic device having a housing comprising a thermal management material is also described herein.