The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Sep. 29, 2020
Sekisui Chemical Co., Ltd., Osaka, JP;
Tomohiro Horinouchi, Yamaguchi, JP;
Mitsuo Matsumoto, Yamaguchi, JP;
Ryota Yamasugi, Yamaguchi, JP;
Yoshito Arai, Osaka, JP;
Yasunari Kusaka, Osaka, JP;
Nami Nakajima, Osaka, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Abstract
The present invention provides a resin composition for molding having excellent thermal meltability and capable of providing a molded article that is less likely to crack from a resin weld during use and has excellent surface gloss, and a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; a polyvinyl chloride resin; and a melt additive, the resin composition having an area ratio of a peak B observed in a range of 0.6 to 1.0 ppm to a peak A observed in a range of 9.5 to 10 ppm (Area of peak B/Area of peak A) of 1 to 1,000 when aH NMR spectrum is measured by solution NMR.