The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Nov. 05, 2020
Toray Industries, Inc., Tokyo, JP;
TORAY INDUSTRIES, INC., Tokyo, JP;
Abstract
An epoxy resin composition includes: [A] an epoxy resin, [B] an aromatic diamine and [C] one or more compounds having a boiling point of 130° C. or more, a molecular weight of 50 to 250, no epoxy group and substantially no ability to cure epoxy resin. The following conditions are satisfied: (1) a component [C] compound has polar and hydrogen bond components that when summed in terms of the Hansen solubility parameter equals 10.0 or more; (2) a component [C] compound has a Hansen solubility parameter distance L to component [A] of 20.0 or less; (3) the ratio H/E between moles E of epoxy groups of component [A] and moles C of a component [C] compound satisfying both conditions (1) and (2) is 0.01 to 0.20; and (4) the viscosity of the composition when held at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.