The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
May. 15, 2023
The University of Tokyo, Tokyo, JP;
Riken Technos Corporation, Tokyo, JP;
The University of Tokyo, Tokyo, JP;
RIKEN TECHNOS CORPORATION, Tokyo, JP;
Abstract
A method for manipulating a flake-like material, the method comprising: (2) a step of grounding a first probe of which a tip is covered with a first resin film on the flake-like material left still on a substrate, and pressing the first probe to pick up the flake-like material; (3) a step of grounding a second probe of which a tip is covered with a second resin film on a surface on an opposite side to the first probe of the flake-like material picked up by the first probe in the step (2), and pressing the second probe; and (4) a step of transferring the flake-like material picked up by the first probe to the second probe by separating the first probe and the second probe, wherein (i) a thickness ratio (thickness B/thickness A) of a thickness B of the second resin film to a thickness A of the first resin film when pressing is not performed is less than 1.