The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

May. 26, 2020
Applicants:

Lts Lohmann Therapie-systeme Ag, Andernach, DE;

Km Transderm Ltd., Osaka, JP;

Inventors:

Markus Bee, Ketting, DE;

Helena Gallinger, Koblenz, DE;

Alexander Saifert, Andernach, DE;

Andreas Weber-Stebliwez, Andernach, DE;

Georg Schlögel, Andernach, DE;

Akio Nishiura, Osaka, JP;

Akinori Sasaki, Osaka, JP;

Masaoki Goto, Takasago, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B26F 1/40 (2006.01); A61F 13/02 (2024.01); B26D 7/18 (2006.01); B26F 1/38 (2006.01); B26F 1/44 (2006.01);
U.S. Cl.
CPC ...
B26F 1/40 (2013.01); A61F 13/0276 (2013.01); B26D 7/1818 (2013.01); B26F 1/382 (2013.01); B26F 2001/4418 (2013.01);
Abstract

A tool set for manufacturing adhesive patches, by processing laminate web. The tool set includes a cutting tool having a cutting face lying in a cutting plane, and an embossing tool having a pressing face lying in a pressing plane, where the cutting plane and the pressing plane are parallel. The embossing tool is configured to press an edge area shape of the adhesive patch to be manufactured, and the cutting tool is configured to cut out the adhesive patch to be manufactured by cutting in edge area or outside the edge area. Furthermore, a method of manufacturing adhesive patches. The method essentially includes a feeding step, a pressing step and cutting step. Lastly an adhesive layering having a backing layer and an adhesive matrix layer. The backing layer having a larger size than the adhesive matrix layer.


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