The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Dec. 28, 2021
Applicants:

Ihi Infrastructure Systems Co., Ltd., Sakai, JP;

Ihi Corporation, Tokyo, JP;

Inventors:

Naoyuki Matsumoto, Tokyo, JP;

Yoshihiko Nakamura, Sakai, JP;

Shinya Osawa, Sakai, JP;

Koutarou Inose, Tokyo, JP;

Junko Yamada, Tokyo, JP;

Daiki Okita, Tokyo, JP;

Akira Katou, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/342 (2014.01); B23K 26/073 (2006.01); B23K 26/08 (2014.01); E01D 22/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B23K 26/073 (2013.01); B23K 26/0876 (2013.01); E01D 22/00 (2013.01);
Abstract

Irradiation with a laser beam is performed along a welding bead, while the laser beam is aimed, as an irradiation point of the laser beam, at a contact point between a deck plate and a U-rib that is contained in a non-welded portion of a root part, from a side of the welding bead of the root part. Thereby, it is possible to remove a crack beginning at the non-welded portion of the root part generated at a joining portion between the deck plate and the U-rib of a steel floor slab, by the irradiation with the laser beam.


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