The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Aug. 11, 2020
Applicant:

Convatec Technologies Inc., Las Vegas, NV (US);

Inventors:

Stephen Bishop, Deeside, GB;

Duncan Gilding, Deeside, GB;

Bryony Lee, Deeside, GB;

Shauna Powell, Deeside, GB;

Assignee:

CONVATEC TECHNOLOGIES INC., Las Vegas, NV (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61F 13/05 (2024.01); A61F 13/0203 (2024.01); A61M 1/00 (2006.01);
U.S. Cl.
CPC ...
A61F 13/05 (2024.01); A61F 13/022 (2013.01); A61M 1/73 (2021.05); A61M 1/912 (2021.05); A61M 1/915 (2021.05); A61M 1/982 (2021.05); A61M 1/984 (2021.05); A61M 1/985 (2021.05); A61M 2205/18 (2013.01);
Abstract

A wound exudate management system includes a pump for generating negative pressure, a dressing for covering and protecting a wound of a user, a tube including an interior lumen, the tube disposed between the pump and the dressing such that the pump and the dressing are in fluid communication via the interior lumen. The dressing includes an adhesive layer for adhering the dressing adjacent the wound, a wound contact layer, a pressure dispersion layer, a plurality of layers of absorbent material disposed between the wound contact layer and the pressure dispersion layer, a backing layer having a first surface and a second surface, the first surface of the backing layer being adjacent, and in contact with, the pressure dispersion layer and the adhesive layer, and a flexible connector disposed on the second surface of the backing layer.


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