The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Nov. 09, 2022
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Yong Hoon Kwon, Suwon-si, KR;

Mi Sun Kim, Hwaseong-si, KR;

Dong Sung Lee, Suwon-si, KR;

Se Hun Choi, Asan-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/60 (2025.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01);
U.S. Cl.
CPC ...
H10D 86/60 (2025.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 25/167 (2013.01); H10D 86/0212 (2025.01); H10D 86/441 (2025.01); H01L 24/16 (2013.01); H01L 2224/03019 (2013.01); H01L 2224/03612 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/16237 (2013.01);
Abstract

A display device includes a substrate, a first metal layer on the substrate, a first barrier insulating layer on the first metal layer, an etching control layer on the first barrier insulating layer, a first contact hole passing through the substrate, the first barrier insulating layer, and the etching control layer, a second barrier insulating layer on the etching control layer and including a second contact hole, a fan-out line on the second barrier insulating layer and included in a second metal layer, a pad part inserted into the second contact hole and included in the second metal layer, the pad part integral with the fan-out line, a display layer on the fan-out line, and a flexible film under the substrate and inserted into the first contact hole to be electrically connected to the pad part. The first metal layer includes an etching mark adjacent to the first contact hole.


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