The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Mar. 24, 2023
Applicant:

Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Yibo Wang, Shanghai, CN;

Wengang Luo, Shanghai, CN;

Yunfei Qiao, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H05K 7/20409 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01);
Abstract

A power module includes a housing, a circuit component, and a package. The housing includes a main housing, a heat sink, and a fastening layer. A first outer surface of the main housing is provided with a groove. The fastening layer is disposed on a bottom surface of the groove. The heat sink is located on a side opposite to an orientation of the groove. The circuit component includes a heat dissipation surface and a pin. The heat dissipation surface is fastened to the fastening layer through welding. The pin extends out of the first outer surface in a direction away from the fastening layer. The package is configured to cover the circuit component, and to at least partially expose a distal end of the pin.


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