The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Oct. 31, 2022
Boe Technology Group Co., Ltd., Beijing, CN;
Nianqi Yao, Beijing, CN;
Kun Zhao, Beijing, CN;
Ce Ning, Beijing, CN;
Zhengliang Li, Beijing, CN;
Zhanfeng Cao, Beijing, CN;
Ke Wang, Beijing, CN;
Jiaxiang Zhang, Beijing, CN;
Qi Qi, Beijing, CN;
Hehe Hu, Beijing, CN;
Feifei Li, Beijing, CN;
Jie Huang, Beijing, CN;
Jiayu He, Beijing, CN;
Beijing BOE Technology Development Co., Ltd., Beijing, CN;
Abstract
A circuit board includes a substrate, a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer includes a plurality of first conductive portions. The second conductive layer includes a plurality of second conductive portions. A second conductive portion passes through a first via hole in the first insulating layer to be in electrical contact with a first conductive portion. The first conductive layer and the second conductive layer each include at least one main conductive layer, which is capable of creating a first intermetallic compound with solder. At least one of the first conductive layer and the second conductive layer further includes a stop layer capable of creating a second intermetallic compound with the solder. A rate of a reaction between the stop layer and the solder is lower than a rate of a reaction between the main conductive layer and the solder.