The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Sep. 29, 2022
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventor:

Chung Hoon Lee, Ansan-si, KR;

Assignee:

SEOUL VIOSYS CO., LTD., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 23/00 (2006.01); H10H 20/813 (2025.01); H10H 20/825 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H01L 25/0756 (2013.01); H01L 24/32 (2013.01); H01L 25/0753 (2013.01); H10H 20/813 (2025.01); H10H 20/825 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H01L 2224/32145 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A light emitting device including a protection layer including a first area and a second area having a greater thickness than the first area, a light emitting stacked structure including a plurality of semiconductor layers sequentially disposed one over another along a first direction on the first area of the protection layer, a plurality of via patterns electrically connected to the light emitting stacked structure and having a length along the first direction, and a plurality of pads electrically connected to the light emitting stacked structure through the via patterns, respectively, in which the second area of the protection layer does not overlap the light emitting stacked structure, and at least portion of the pads overlaps the second area of the protection layer and one of the via patterns.


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