The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Oct. 17, 2022
Newport Fab, Llc, Newport Beach, CA (US);
Edward Preisler, San Clemente, CA (US);
Zhirong Tang, Lake Oswego, OR (US);
Newport Fab, LLC, Newport Beach, CA (US);
Abstract
A method of forming a semiconductor structure having a first substrate capable of electrically and mechanically connecting to a second substrate includes providing a first substrate without a solder bump. A solder bump receiving metal is formed over a top interconnect metal of the first substrate. The solder bump receiving metal may include platinum, a platinum alloy, nickel, or a nickel alloy. A passivation layer is formed, wherein the passivation layer is not situated under any portion of the solder bump receiving metal. A window is formed exposing a portion of the solder bump receiving metal. The method may further include providing a second substrate with a second substrate solder bump. The second substrate solder bump may be mechanically and electrically connecting to the exposed portion of the solder bump receiving metal of the first substrate.