The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Sep. 29, 2022
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Chia-Lin Yang, Miao-Li County, TW;

Sheng-Nan Chen, Miao-Li County, TW;

Kuang-Ming Fan, Miao-Li County, TW;

Kuan-Feng Lee, Miao-Li County, TW;

Jui-Jen Yueh, Miao-Li County, TW;

Chin-Ming Huang, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/3677 (2013.01); H01L 23/49816 (2013.01); H01L 23/5386 (2013.01); H01L 24/08 (2013.01); H01L 24/09 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/0903 (2013.01); H01L 2924/30101 (2013.01);
Abstract

An electronic device includes an electronic unit, a circuit layer and a bonding pad. The electronic unit includes a chip, an insulating layer and a first conductor layer. The insulating layer is disposed on the chip, the insulating layer includes a first opening, and the first conductor layer is disposed in the first opening. The circuit layer is disposed corresponding to the electronic unit, and the circuit layer includes a second opening and a second conductor layer disposed in the second opening. The bonding pad is in contact with the second conductor layer, and the bonding pad is electrically connected to electronic unit. The first conductor layer has a first height, the second conductor layer has a second height, and a ratio of the first height to the second height is greater than or equal to 0.1 and less than or equal to 0.9.


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