The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Mar. 23, 2021
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Yuto Tanaka, Kanagawa, JP;
Shuichi Oka, Kanagawa, JP;
Shun Mitarai, Kanagawa, JP;
Kiwamu Adachi, Kanagawa, JP;
Takahiro Igarashi, Kanagawa, JP;
Hiizu Ohtorii, Kanagawa, JP;
Naoki Kakoiyama, Kanagawa, JP;
Kousuke Seki, Kanagawa, JP;
Hiroyuki Shigeta, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
Provided is a semiconductor device capable of maintaining the flatness of a glass substrate and sufficiently protecting an end portion of the glass substrate. The semiconductor device includes a glass substrate including a first surface, a second surface opposite to the first surface, and a first side surface between the first surface and the second surface. The semiconductor device further includes wirings provided provided on the first and second surfaces, a first insulating film that covers the first surface, a second insulating film that covers the second surface, and a third insulating film that covers the first side surface, the third insulating film being continuous with at least one of the first or second insulating films.