The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Jun. 23, 2021
Applicants:

Imec Vzw, Leuven, BE;

Universiteit Gent, Ghent, BE;

Inventors:

Tom Sterken, Merelbeke, BE;

Geert Van Steenberge, Sint-Amandsberg, BE;

Assignees:

IMEC VZW, Leuven, BE;

Universiteit Gent, Ghent, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B23K 26/0622 (2014.01); B23K 26/073 (2006.01); B23K 26/57 (2014.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B23K 26/0622 (2015.10); B23K 26/073 (2013.01); B23K 26/57 (2015.10); H10H 20/857 (2025.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H10H 20/0364 (2025.01);
Abstract

A method for accurately positioning a component on a receiver substrate is provided. The component is transferred from a donor substrate to a receiver substrate facing the donor substrate. The method comprises creating at least one nozzle at a predefined location in the area of contact between a blister forming layer on the donor substrate, and a component attached to the donor substrate by adhesion to the blister forming layer. The blister forming layer comprises at least a dynamic release layer, consisting of a dynamic release material. The application of the laser beam creates a blister that contains vaporized dynamic release material. The blister expands until a nozzle is created, the nozzle allowing the vaporized dynamic release material to exit the blister and cause the release of the component and its propulsion towards the receiver substrate. The nozzle releases the material in the form of a narrow jet of gas.


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