The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
May. 20, 2022
Applicant:
Joanneum Research Forschungsgesellschaft Mbh, Graz, AT;
Inventors:
Assignee:
Joanneum Research Forschungsgesellschaft mbH, Graz, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/30 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0035 (2013.01); G03F 7/0005 (2013.01); G03F 7/30 (2013.01); G03F 7/70008 (2013.01); G03F 7/70291 (2013.01); G03F 7/70383 (2013.01); G03F 7/70416 (2013.01); G03F 7/705 (2013.01); G03F 7/70508 (2013.01); G03F 7/70558 (2013.01); G03F 9/7003 (2013.01);
Abstract
The invention relates to a lithographic process for embossing three-dimensional microstructures, which have oversized structure heights, in a photostructurable carrier material using an exposure device, wherein an oversized structure height has a height which exceeds the value of the maximum nominal penetration depth. The process comprises the following process steps:
Quick Actions:
Kuna, Ladislav. (2025). Lithographic method for imprinting three-dimensional microstructures having oversized structural heights into a carrier material (U.S. Patent No. 12455503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12455503
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile