The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Aug. 06, 2019
Applicant:

Dexerials Corporation, Shimotsuke, JP;

Inventors:

Jun Yamamoto, Shimotsuke, JP;

Akira Suzuki, Shimotsuke, JP;

Toshiyuki Minegishi, Shimotsuke, JP;

Kazuhiro Date, Shimotsuke, JP;

Assignee:

DEXERIALS CORPORATION, Shimotsuke, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 153/02 (2006.01); B32B 7/12 (2006.01); B32B 25/08 (2006.01); B32B 25/14 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C09J 153/025 (2013.01); B32B 7/12 (2013.01); B32B 25/08 (2013.01); B32B 25/14 (2013.01); B32B 2457/08 (2013.01); H05K 3/281 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01);
Abstract

An adhesive composition having a low dielectric constant, low dielectric loss tangent, excellent folding endurance, and excellent heat resistance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 70 to 90 parts by mass of the styrene elastomer; 5 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 42%.


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