The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Mar. 31, 2023
Applicant:
Elite Material Co., Ltd., Taoyuan, TW;
Inventors:
Assignee:
ELITE MATERIAL CO., LTD., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 51/00 (2006.01); C08F 232/08 (2006.01); C08F 236/20 (2006.01); C08F 279/00 (2006.01); C08J 5/24 (2006.01); C08L 45/00 (2006.01);
U.S. Cl.
CPC ...
C08L 51/003 (2013.01); C08F 232/08 (2013.01); C08F 236/20 (2013.01); C08F 279/00 (2013.01); C08J 5/244 (2021.05); C08L 45/00 (2013.01); C08J 2351/00 (2013.01); C08J 2471/12 (2013.01);
Abstract
A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.