IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12454088 B1

PDFFull Text
Date of Patent:
Oct. 28, 2025

Filed:

Oct. 02, 2023

Lcp extruded film and method for manufacturing the same, lcp extruded film for stretch treatment, lcp stretched film, heat-shrinkable lcp stretched film, insulating material for circuit substrate, and metal foil-clad laminate

Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Yusuke Masuda, Tokyo, JP;

Naoki Ogawa, Tokyo, JP;

Assignee:

Denka Company Limited, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Zachary M Davis

Int. Cl.
CPC ...
B29C 48/23 (2019.01); B29C 48/00 (2019.01); B29C 48/08 (2019.01); B29C 48/14 (2019.01); B29C 48/78 (2019.01); B32B 5/02 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 27/12 (2006.01); C08J 5/18 (2006.01); C09K 19/38 (2006.01); H05K 1/03 (2006.01); B29C 48/21 (2019.01); B29C 48/305 (2019.01); B29K 105/00 (2006.01); B29K 105/16 (2006.01); B29K 509/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 48/23 (2019.02); B29C 48/022 (2019.02); B29C 48/08 (2019.02); B29C 48/146 (2019.02); B29C 48/78 (2019.02); B32B 5/024 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 27/12 (2013.01); C08J 5/18 (2013.01); C09K 19/3809 (2013.01); H05K 1/0366 (2013.01); B29C 48/0021 (2019.02); B29C 48/21 (2019.02); B29C 48/305 (2019.02); B29K 2105/0079 (2013.01); B29K 2105/16 (2013.01); B29K 2509/00 (2013.01); B29K 2995/0012 (2013.01); B29K 2995/005 (2013.01); B29K 2995/007 (2013.01); B29K 2995/0097 (2013.01); B29L 2031/3425 (2013.01); B32B 2250/03 (2013.01); B32B 2305/55 (2013.01); B32B 2307/30 (2013.01); B32B 2307/536 (2013.01); B32B 2307/7376 (2023.05); B32B 2457/08 (2013.01); C08J 2367/04 (2013.01); C09K 2219/03 (2013.01); H05K 2201/0125 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/029 (2013.01);
Abstract

The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 μm or more and 300 μm or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200° C. as measured by a TMA method according to JIS K7197 are each within a range of −30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate:

Find Patent Forward Citations

Loading…