The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
May. 25, 2023
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Yohei Sato, Tokyo, JP;
Hiroshi Koizumi, Tokyo, JP;
Osamu Shindo, Tokyo, JP;
Mitsuyoshi Makida, Tokyo, JP;
Masashi Matsumoto, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23Q 1/03 (2006.01);
U.S. Cl.
CPC ...
B23Q 1/032 (2013.01);
Abstract
A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.
Sato, Yohei. (2025). Substrate processing apparatus (U.S. Patent No. 12454032). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12454032
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile