The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Dec. 05, 2023
Applicant:
Red Oak Innovations Limited, Dublin, IE;
Inventors:
Chandra Lius, Miao-Li County, TW;
Yuan-Lin Wu, Miao-Li County, TW;
Assignee:
Red Oak Innovations Limited, Dublin, IE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/153 (2006.01); G02F 1/133 (2006.01); G02F 1/1333 (2006.01); G02F 1/1343 (2006.01); G02F 1/1347 (2006.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10D 86/85 (2025.01); H10D 89/00 (2025.01); H10K 50/844 (2023.01); H10K 59/00 (2023.01); H10K 77/10 (2023.01); G09F 9/30 (2006.01); H10K 59/12 (2023.01); H10K 59/80 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 77/111 (2023.02); G02F 1/13306 (2013.01); G02F 1/133305 (2013.01); G02F 1/133308 (2013.01); G02F 1/1343 (2013.01); G02F 1/1347 (2013.01); G02F 1/1533 (2013.01); H10D 30/67 (2025.01); H10D 30/6729 (2025.01); H10D 62/116 (2025.01); H10D 86/471 (2025.01); H10D 86/60 (2025.01); H10D 86/85 (2025.01); H10D 89/213 (2025.01); H10K 50/8445 (2023.02); H10K 59/00 (2023.02); C09K 2323/00 (2020.08); C09K 2323/03 (2020.08); G09F 9/301 (2013.01); H10K 59/12 (2023.02); H10K 59/8731 (2023.02); H10K 2102/311 (2023.02);
Abstract
A flexible electronic assembly includes a flexible supporting assembly, an electronic component, and a cover layer. The flexible supporting assembly includes a first surface and a second surface opposite to the first surface. In a plan view of the flexible electronic assembly, the second surface includes a plurality of protrusions and one of the protrusions includes at least one rounded corner. The electronic component is coupled to the first surface of the flexible supporting assembly. The cover layer is coupled to the electronic component.