Semiconductor device having stacked semiconductor chips interconnected with support structures via tsv

Abstract

A semiconductor package including a first semiconductor chip; second semiconductor chips sequentially stacked on the first semiconductor chip; a front connection pad on a lower surface of each of the second semiconductor chips; a rear connection pad attached to an upper surface of each of the first semiconductor chip and the second semiconductor chips; a chip connection terminal between the front connection pad and the rear connection pad; and a support structure between the first semiconductor chip and one of the second semiconductor chips and between adjacent ones of the second semiconductor chips, the support structure being spaced apart from the front connection pad, the rear connection pad, and the chip connection terminal, having a vertical height greater than a vertical height of the chip connection terminal, and including a metal.