The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Oct. 11, 2021
Applicant:
Toshiba Mitsubishi-electric Industrial Systems Corporation, Chuo-ku, JP;
Inventor:
Mitsuru Hano, Tokyo, JP;
Assignee:
TMEIC CORPORATION, Chuo-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01);
Abstract
A cooler of an embodiment includes a contact surface, a flow path formation portion, a supply portion, a discharge portion, and at least one retention portion. The contact surface is in contact with a cooling target object. A flow path through which a refrigerant flows is formed in the flow path formation portion. The supply portion supplies the refrigerant to the flow path. The discharge portion discharges the refrigerant from the flow path. The retention portion changes a flow path cross-sectional area so as to promote retention of the refrigerant locally in the flow path.