The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Jan. 02, 2025
Applicant:

Xmems Labs, Inc., Santa Clara, CA (US);

Inventors:

Chiung C. Lo, San Jose, CA (US);

Wen-Chien Chen, New Taipei, TW;

Chun-I Chang, Hsinchu County, TW;

Assignee:

xMEMS Labs, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H10N 30/20 (2023.01); H10N 30/88 (2023.01); H10N 39/00 (2023.01);
U.S. Cl.
CPC ...
H05K 7/20154 (2013.01); H10N 30/2047 (2023.02); H10N 30/88 (2023.02); H10N 39/00 (2023.02);
Abstract

An electronic device includes an operational component, a heat conductive component and an airflow generating package. The operational component produces a heat while operating. The heat conductive component is configured to conduct the heat generated by the operational component, wherein the operational component is disposed on the heat conductive component. The airflow generating package is disposed by an edge of the electronic device. The airflow generating package includes a film structure, the film structure includes a flap pair, and the flap pair includes a first flap and a second flap. The flap pair operates at an ultrasonic rate to produce an airflow. The heat conductive component extends toward the airflow generating package, such that the airflow generated by the airflow generating package flows through the heat conductive component, so as to dissipate the heat generated from the operational component through the heat conductive component.


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