The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jan. 27, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Do Jae Yoo, Suwon-si, KR;
Yong Gil Namgung, Suwon-si, KR;
Jong Hoon Shin, Suwon-si, KR;
Won Ju Jang, Suwon-si, KR;
Yun Hwan Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 1/0296 (2013.01); H05K 1/0306 (2013.01); H05K 1/053 (2013.01); H05K 3/10 (2013.01); H05K 2201/0206 (2013.01); H05K 2203/013 (2013.01);
Abstract
A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.