The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Oct. 22, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Seong Hwan Im, Seoul, KR;

Seon Mo Gu, Seoul, KR;

Ki Tae Kwon, Seoul, KR;

Chang Je Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01Q 1/38 (2013.01); H05K 2201/0191 (2013.01);
Abstract

A circuit board according to an embodiment includes a first substrate layer; a second substrate layer disposed on the first substrate layer; and a third substrate layer disposed under the first substrate layer; wherein the second substrate layer includes: a first inner circuit pattern layer disposed on the first substrate layer; and a first outermost circuit pattern layer disposed on the first inner circuit pattern layer; wherein the third substrate layer includes: a second inner circuit pattern layer disposed under the first substrate layer; and a second outermost circuit pattern layer disposed under the second inner circuit pattern layer; wherein a thickness of the first outermost circuit pattern layer is greater than a thickness of each of the first inner circuit pattern layer and the second inner circuit pattern layer.


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