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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12452514 B1

PDFFull Text
Date of Patent:
Oct. 21, 2025

Filed:

Apr. 21, 2023

Camera module having image sensor located between first and second circuit boards

Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Jae Keun Park, Seoul, KR;

Assignee:

LG INNOTEK CO., LTD., Seoul, KR;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Usman A Khan

Int. Cl.
CPC ...
H04N 23/57 (2023.01); G02B 5/20 (2006.01); G02B 7/00 (2021.01); G02B 7/02 (2021.01); G02B 7/08 (2021.01); G02B 7/09 (2021.01); G02B 13/00 (2006.01); G02B 27/64 (2006.01); G03B 5/00 (2021.01); G03B 11/00 (2021.01); G03B 13/36 (2021.01); H01L 23/498 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/14 (2006.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H04N 23/57 (2023.01); G02B 7/004 (2013.01); G02B 7/08 (2013.01); G02B 7/09 (2013.01); G02B 13/001 (2013.01); G02B 27/646 (2013.01); G03B 5/00 (2013.01); G03B 11/00 (2013.01); G03B 13/36 (2013.01); H01L 23/498 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/144 (2013.01); H05K 1/147 (2013.01); H10F 39/804 (2025.01); H10F 39/806 (2025.01); H10F 39/811 (2025.01); G02B 5/208 (2013.01); G02B 7/021 (2013.01);
Abstract

A camera module includes a lens driving device having a housing, a first circuit board disposed below the housing, a filter disposed on an upper surface of the first circuit board, a second circuit board disposed below the first circuit board, an image sensor disposed on the second circuit board and coupled to a lower surface of the first circuit board, and a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board, and electrically connecting the first circuit board and the second circuit board. A lower surface of the image sensor is higher than the upper surface of the second circuit board.

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