The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Apr. 06, 2021
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventor:

Shoji Akiyama, Gunma, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/08 (2006.01); C30B 29/30 (2006.01); C30B 33/06 (2006.01); C30B 33/08 (2006.01); H03H 9/02 (2006.01); H03H 9/25 (2006.01); H10N 30/072 (2023.01); H10N 30/073 (2023.01);
U.S. Cl.
CPC ...
H03H 3/08 (2013.01); C30B 29/30 (2013.01); C30B 33/06 (2013.01); C30B 33/08 (2013.01); H03H 9/02559 (2013.01); H03H 9/02574 (2013.01); H03H 9/25 (2013.01); H10N 30/072 (2023.02); H10N 30/073 (2023.02); Y10T 29/42 (2015.01);
Abstract

A composite substrate capable of improving temperature characteristics while suppressing crack generation and a method for manufacturing such composite substrate is provided. The method for manufacturing composite substrates includes: a step of preparing a piezoelectric material substrate having a rough surface; a step of removing the damaged layer by etching the rough surface of the piezoelectric material substrate using a chemical process; a step of depositing an intervening layer on the rough surface of the piezoelectric material substrate from which the damaged layer has been removed; a step of flattening the surface of the deposited intervening layer; a step of bonding the piezoelectric material substrate to a support substrate having a lower thermal expansion coefficient than the piezoelectric material, with the deposited intervening layer in between; and a step of thinning the piezoelectric material substrate after bonding. Lithium tantalate (LT) or lithium niobate (LN) are suitable as the piezoelectric material.


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